Wafer Production Line
- Oven
- Sheet Cooling
- Cream Spreading
- Block Cooling
- Spiral Cooling
- Wafer Cutting
- Separating & Distributing
The wafer oven is used to automatically bake wafer sheets into the desired shape from the prepared wafer dough. The furnace consists of a frame, mold, burner system, gas system, front extractor gear and rear tension systems.
The molds to international standards are heated with a heating system compatible with natural gas, liquefied gas or electricity. With the best heat dissipation and high thermal insulation, economical and efficient operation is ensured, as well as production without human contact with its fully automatic function.
Thanks to the servo-controlled air and gas system, a continuous, gentle and desired flame is provided. The baking time, which varies depending on the dough formula, the raw material, the thickness of the wafer plate, is ideally between 2 and 2:30 minutes.
Dough dispensing, dough transfer, baking system, leaf burrs and leaf removal functions are done automatically. Adjustments and interventions are done easily and quickly with the practical control panel. Flame control is done digitally from the control panel. Its equipments such as bulk dough pump, dough kneader, dough tank, dough transfer pumps are completely made of stainless material.
The sheet cooling machine is an environment preparation machine in which the baked wafer plate is automatically taken, cooled in the air environment and turned on. Sheet cooling consists of a stainless steel frame and wires carrying sheets, O-ring bands at the inlet and outlet.
In the sheet cooling machine, which works in harmony with the wafer oven and the next creamer spreader, the wafer sheets are taken out of the oven and the cooling input is carried out by a belt system.
The cooling output can be done manually or automatically.
Broken plates are separated at the entrance to the machine and stacking can be optionally performed at the exit.
The body of the wafer sheet cooling machine is made of aluminum and stainless steel.
The cream spreading machine turns the wafer into blocks by applying fluid and air cream of the desired thickness on the wafer sheets coming from the leaf cooling and stacking them on top of each other. The cream spreading machine consists of the main chassis, inlet group, feeding group, spreading group, layer group, joining group, hazelnut group, pressure group and upper group. Thanks to this machine, the process of applying cream and making blocks without touching the wafer leaves and cream is performed quickly and hygienically. The machine turns the wafer into blocks by applying cream on the wafer sheets coming from the leaf cooling and stacking them on top of each other.
- All sides of the machine are made of stainless steel.
- It is suitable for food codex.
- The liquid spreads the cream onto the wafer plate.
- It has the feature of adjusting the cream to the desired thickness.
- Printing feature with piston mechanism at the end of the exit band.
- Manual or automatic feeding feature.
- Floor thicknesses can be adjusted automatically.
- Wafer blocks are formed with the rotating folding feature.
- Automatic transition from leaf cooling is possible.
- It has a top plate overclock system.
- Continuous leaf spreading feature.
- The hot water system collects the waste cream and the automatic transfer machine system (jacketed), the waste cream transfer pumps are stainless.
- It has a stainless pan system that collects the pollution caused by wafer crumbs and dust.
- Under chassis rotating belt system that collects cream contamination.
- The cream pouring chamber is height adjustable.
- It has touch screen. The number of floors, speed settings, error signals and location can be easily adjusted through the screen.
The wafer block cooling machine is composed of special shelves with blocking rack, cooling unit, dehumidifying unit and lined covers insulated with polyurethane material.
The wafer block cooling machine is a special machine used to freeze cream and dry moisture before the cream coated wafer blocks (made up of layers of wafer and cream) enter the cutting machine.
It covers at least 50% less area than conveyor belt tunnels. It is very easy to set up and use. The refrigeration cabinet works with the control of the photocell located in the inlet strip. If the blocking of the wafer does not occur, it goes into standby mode after all the blockages inside are cleared. Thus, energy savings are achieved.
The cooling cabinet is controlled by PLC.
The cooling power varies depending on the capacity and the dehumidification (drying) system.
By choosing a dual cooler system, the cream, which is still hot at the inlet, is cooled as quickly as possible and unwanted cream flow is avoided.
This is the cooler used to lower the creamy wafer blocks to certain temperatures with cooling systems.
It can be specially adjusted according to the capacity of the line.
The cooling capacity starts from at least 18,000 kcal / h and varies according to its capacity.
The product is transported by means of a steel metal tape suitable for feeding, which is wound in a spiral.
The belt speed works synchronously with the throughput of the production line.
The wafer cutting machine (whose product is specific to cooling systems) cuts cream coated wafer blocks into the desired dimensions either in blocks or individually.
The wafer blocks are perfectly cut in width and length.
The cutting machine includes a frame, cutting (1st and 2nd cutting), printing, power supply (1st and 2nd heating), layer group, tension group (soldier group), electrical panel and sheets where cutting waste is collected.
There is an automatic transition after the block cooling machine and a block rotation system before cutting.
The cooled insert blocks are brought to the most suitable cutting position selected by the rotator.
Manual or automatic feeding can be performed on the machine.
It is the machine used to cut between the wafers precut to the dimensions of the final product in the wafer cutting machine.
It ensures that the products are aligned before they enter the chocolate enrobing machine..
The plates aligned on the separation table are separated from each other by an intermediate opening strip.
It works in harmony with wafer cutting machine and chocolate enrobing machine.
- Cream Mixer & Tank
- Powdered Sugar Mill
- Fat Melting Machine
- Discard Mill
- Humidifying Tunnel
- Dough Preparation Mixer
The prepared product is transferred to the stock tank on its side by means of pumps. It is the machine which allows to prepare in a homogeneous way the cream applied between the plates of wafers. He has anchors and drummers. It is suitable for the preparation of liquid or solid cream. The prepared product is transferred to the side of the storage tank by means of pumps.
This is a sieve type mill used to convert powdered sugar into sugar and use in the production line. There is a sugar reservoir and a spiral on the side for the convenience of the user. Screen replacement and cleaning operations are designed to provide user convenience. Particle size can vary from a minimum of 40 microns to a maximum of 70 microns.
It is a machine that liquefies solid fats for use in the preparation of products such as wafers, chocolate, caramel. There are coils inside with hot water. The molten oil is easily transferred to the desired machine by means of a pump.
It is the machine used to grind the unused side edges of the cut wafer blocks in the wafer cutting machine during the operation of the production line and to mix them back into the cream in the preparation of the cream. Using the spiral and steel blades inside, the wafer particles are properly ground. Suitable for crushing waste from wafers, cookies and cakes.
It is the machine used to stabilize the moisture content of the wafer sheets coming out of the cooling sheets. It works synchronously with the leaf cooling and plowing machine. The wafer production line is specially designed according to its capacity. The outer part of the machine is thermally insulated. The outer part of the machine is thermally insulated. It can be easily controlled from the machine's touch screen.
This is the installation required for homogeneous mixing of the wafer dough and fully automatic feeding into one or more wafer baking ovens. The installation has a kneader, a dough feed pump, a dough resting tank and connection pipes. The necessary dough ingredients are placed in the mixer manually or automatically. The water is automatically filled to the required dosages. The raw materials are then mixed piece by piece in a particularly gentle and efficient process. The homogeneous wafer dough is pumped to the resting tank, from there it is continuously fed to an automatic wafer baking oven using another pump. Stainless steel design adapted to food codes. Automatic dough bypass system. Dough filtering function. Complete sealing is included in the system with special connection components.